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PCB Capabilities

PCB Capabilities

ZF's printed circuit board process capability


With over 15 years of experience as a professional printed circuit board (PCB) manufacturer, ZF Electronics offers a wide range of PCB process capabilities that can meet all of your PCB needs. Some of the key process capabilities that ZF can provide and support are detailed below, where you can find information on the specific materials we offer, the types of PCB technology or products currently in production, and some tolerances.


Available Printed Circuit Boards from ZF


The first category is "Quick-turn", which means that ZF can quickly provide small quantities of quick-turn PCBs with custom specifications.

The second category is "advanced" products. ZF can provide the best, full specification, highly specialized precision PCBs.


Key process capabilities offered and supported by ZF


1. Product Showcase

Rigid PCB, Flexible PCB, Rigid-flex PCB, Metal Core PCB, Aluminum PCB, Halogen-Free PCB, Thick Copper PCB, HDI PCB, Copper Based PCB


2.Surface treatment         


Surface treatmentMaterials used
Electroless nickel gold plating (ENIG)FR4 standard Tg
Hot Air Solder Level (HASL, Led, and Lead-Free)FR4 Medium Tg
OSP, Dip Tin, Dip Silver, ENEPIGFR4 High Tg
Gold Finger, Flash Gold, Full Body Hard Gold, Solderable Wire GoldHalogen Free
Selective and multiple surface finishesRF materials
Carbon ink, peelable SMFlexible circuit materials, aluminum backplanes


Type

Fast Prototype

Volume Production

Scope

Double Side、Multilayers(4-20)

Multilayers(4-28), HDI(4-20)Flex, Rigid Flex

Double Side

CEM-3, FR-4, Rogers RO4233,Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm)

CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Multilayers

4-20 layers, board thickness 15mil-126mil (0.38mm-3.2mm)

4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)

Buried/Blind Via

4-18 layers, board thickness 15mil-126mil(0.38mm-3.2mm)

4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)

HDI

/

1+N+1, 2+N+2, 3+N+3, Anylayer

Flex & Rigid-Flex PCB

/

1-8layers Flex PCB, 2-12layers Rigid-flex PCB HDI+Rigid-flex PCB

Laminate

Shengyi, EMC, ITEQ, Panasionic, Hitachi...

Soldermask Type(LPI)

Taiyo, Goo's, Probimer...

Taiyo, Goo's, Probimer FPC...

Peelable Soldermask

Peters

Carbon ink

Nippon

HASL/Lead-Free HASL

Thickness: 0.5-40um

Thickness: 0.5-40um

OSP

Entek Plus HT, Preflux F2 LX

ENIG (Ni-Au)

Au:0.03um≤max<0.06um Ni:3um≤max≤6um

Electro-bondable Ni-Au

Au:0.2-1.0um Ni: 2.54-10um

Electro-nickel palladium Ni-Au


Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Electro. Hard Gold

Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)

Thick tin

1.0-1.4um

Capability

Mass Production

Mass Production

Min Mechanical Drill Hole

0.20mm

0.20mm

Min. Laser Drill Hole

/

4mil (0.100mm)

Line Width/Spacing

3mil/3mil

2mil/2mil

Max. Panel Size

18.5" X 24.5"(470mm X 622mm)

21.5" X 24.5"(546mm X 622mm)

Line Width/Spacing Tolerance

+/-10% ~ +/-20%

Non electro coating:+/-5um,Electro coating:+/-10um

PTH Hole Tolerance

+/-0.003inch(0.075mm)

+/-0.002inch(0.050mm)

NPTH Hole Tolerance

+/-0.002inch(0.050mm)

+/-0.002inch(0.050mm)

Hole Location Tolerance

+/-0.003inch(0.075mm)

+/-0.002inch(0.050mm)

Hole to Edge Tolerance

+/-0.004inch(0.100mm)

+/-0.004inch(0.100mm)

Edge to Edge Tolerance

+/-0.004inch(0.100mm)

+/-0.004inch(0.100mm)

Layer to Layer Tolerance

+/-0.004inch(0.100mm)

+/-0.003inch(0.075mm)

Impedance Tolerance

+/- 10%

+/- 10%

Warpage %

Max ≤0.75%

Max≤0.5%

Technology (HDI Product)

ITEM

Production

Tighten Control

Laser Via Drill/Pad

0.125/0.30, 0.125/0.38

0.125/0.28,  0.125/0.36, 0.20/0.40

Blind Via Drill/Pad

0.25/0.50

0.20/0.45

Line Width/Spacing

0.10/0.10

0.075/0.075

Hole Formation

CO2 Laser Direct Drill


Build Up Material

FR4 LDP(LDD); RCC 50 ~100 micron


Cu Thickness on Hole Wall

Blind Hole: 10um(min)

Buried Hole: 13um(min)

Aspect Ratio

0.8: 1


Technology (Flexible PCB)

Project

Ability

Roll to roll (one side)

YES

Roll to roll (double)

NO

Volume to roll material width mm

250

Minimum production size mm

250x250

Maximum production size mm

500x500

SMT Assembly patch (Yes/No)

YES

Air Gap capability (Yes/No)

YES

Production of the hard and soft binding plate(Yes/No)

YES

Max layers(Hard)

10

Tallest layer(Soft plate)

6

Material Science


PI

YES

PET

YES

Electrolytic copper

YES

Rolled Anneal Copper Foil

YES

PI


Covering film alignment tolerance mm

±0.1

Minimum covering film  mm

0.175

Reinforcement


PI

YES

FR-4

YES

SUS

YES

EMI SHIELDING


Silver Ink

YES

Silver Film

YES


Contact Us
Phone: +86-188 7956 1688
Address: No.52, Jianshi Industrial Park, Xinqiao Street, Baoan District, Shenzhen, China
No.52, Jianshi Industrial Park, Xinqiao Street, Baoan District, Shenzhen, China
service@zfpcba.com
+86-188 7956 1688