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Thick Copper PCB
Thick Copper PCB

Thick Copper PCB

PCBs are usually bonded to a layer of copper foil on a glass epoxy substrate, the thickness of which is usually 18μm, 35μm, 55μm and 70μm.


The most commonly used thickness of copper foil is 35μm. The use of that in China is generally from 35 to 50μm while there are also thinner ones than this such as 10μm and 18μm and thicker ones than this such as 70μm. The thickness of copper foil on 1 ~ 3mm thick substrate is about 35μm; that on less 1 mm 18μm and that more than 5mm 55μm.


If the thickness of the copper foil on the PCB is 35μm and the conductor width is 1mm, then its resistance value is about 5mΩ and its inductance is about 4nH for every 10mm length. When the di/dt of the digital integrated circuit chip on the PCB is 6mA/ns with the 30mA working current, the resistance and inductance contained in each 10mm printed line which are used to estimate the noise voltage generated by each part of the circuit are relatively 0.15mV and 24mV.

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Types of thick copper PCB


single-sided PCB, double-sided PCB, multilayer PCB, flexible PCB, buried via PCB.


Maximum processing size


For single-sided, double-sided PCB: 1000mm * 600mm;

For multilayer PCB: 600mm * 600mm


The highest number of layers: 


20 layers


Thickness

Rigid PCB: 0.4mm -4.0mm;

Flexible PCB: 0.025mm-0.15mm


Base material copper foil thickness


Rigid PCB: 18μm(1/ 2OZ ), 35μm( 1OZ ), 70μm( 2OZ)

flexible PCB: 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm


Common substrates for thick copper PCB


FR-4, CEM-3, CEM-1, 94HB, 94VO, polytetrachloroethylene, polyester, polyamide.


The processing capability of thick copper PCB


  • Drilling hole: minimum hole diameter 0.15mm

  • Hole: minimum aperture 0.15mm, plate thickness/aperture ratio 4:1

  • Wire width: minimum wire width: gold plate 0.075mm, tin plate 0.10mm

  • Wire spacing: minimum spacing: gold plate 0.075mm, tin plate 0.10mm

  • Gold-plated plate: nickel layer thickness: ≧2.5μm; gold layer thickness: 0.05-0.1μm or according to customer requirements

  • Tin spray board: tin layer thickness:≧2.5-5μm

  • Milling plate: minimum distance from the line to edge: 0.15mm; minimum distance from hole to edge: 0.2mm; minimum profile tolerance: ±0.12mm

  • Socket chamfer: angle: 30°, 45°, 60°; depth: 1-3mm

  • V cut: angle: 30°, 35°, 45°; depth: 2/3 board thickness; minimum size: 80mm * 80mm

  • Soldering resistance: 85-105℃ / 280℃-360℃

  • Flexural resistance/chemical resistance of the flexible board: in full compliance with international standards.


If you have questions about our thick copper PCB production capacity, or the specifications required for your custom project are not listed on this page, please feel free to contact us. We will reply within one workday. We will continue to provide quotation support and design support. Welcome to learn about our production process.

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Phone: +86-188 7956 1688
Address: No.52, Jianshi Industrial Park, Xinqiao Street, Baoan District, Shenzhen, China
No.52, Jianshi Industrial Park, Xinqiao Street, Baoan District, Shenzhen, China
service@zfpcba.com
+86-188 7956 1688